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Tūhono kāri mahara & tūhono kāri SD & Tūhono CompactFlash

Tūhono Kaihautū CFast,H8.35,Momo LOCK KLS1-CFA-003B

Whakaahua Hua Hua Information CFast Kaihautu Hononga,H8.35,Momo LOCK Whare Rawa: Hangarau kirihou,LCP ki te GF whakakaha,pango ia,UL 94V-0,reiti. Kāpeka:Phosphor Bronze,ia JIS 5210,0.2T Puna:Piano miro Uwhi whakarewa:Stainless steel sheet SUS304 0.2T, Whakakikorua Rohe Solder:100u” matte Tin,50u” min, Nickel underplating over all.

Tūhono Kaihautū CFast,H8.35,PUSH PUSH Momo KLS1-CFA-003A

Whakaahua Hua Hua Information CFast Kaihautu Hononga,H8.35,PUSH PUSH Momo Rawa Whare: Hangarau kirihou,LCP ki te GF whakakaha,pango ia,UL 94V-0,reiti. Kiriata: Hangaia kirihou, LCP me te GF kua whakakaha, pango ia, UL 94V-0, reiti. Kāpeka:Phosphor Bronze,i JIS 5210,0.2T Puna:Piano miro Uwhi whakarewa:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāri raka:Stainless steel SUS 304 Whakakikorua Rohe Solder:100u” matte Tin,50u” mining o...

Tūhono Kaihautū CFast,H6.05,Momo LOCK KLS1-CFA-002B

Whakaahua Hua Hua Information CFast Kaihautu Hononga,H6.05,Momo LOCK Whare Rawa: Hangarau kirihou,LCP ki te GF whakakaha,pango ia,UL 94V-0,reiti. Kāpeka:Phosphor Bronze,ia JIS 5210,0.2T Te uhi whakarewa:Stainless steel sheet SUS304 0.2T, Whakakikorua Rohe Solder:100u” matte Tin,50u” min, Nickel underplating over all.

Tūhono Kaihautū CFast,H6.05,PUSH PUSH Momo KLS1-CFA-002A

Whakaahua Hua Hua Information CFast Kaihautu Hononga,H6.05,PUSH PUSH Momo Rawa Whare: Hangarau kirihou,LCP ki te GF whakakaha,pango ia,UL 94V-0,reiti. Kiriata: Hangaia kirihou, LCP me te GF kua whakakaha, pango ia, UL 94V-0, reiti. Kāpeka:Phosphor Bronze,ia JIS 5210,0.2T Puna:Piano miro Uwhi whakarewa:Stainless steel sheet SUS304 0.2T, Crank:Stainless rod SUS 304. Kāri raka:Stainless steel SUS 304 Whakakikorua Hoapā:30u” whakakikorua koura i roto i te wāhi whakapā me 100u” min....

Tūhono Kaihautū CFast, Poutū SMT KLS1-CFA-001

Whakaahua Hua Hua Information CFast Kaihautū Tūhono, Poutū SMT Material Whare: Hangarau kirihou,LCP ki te GF whakakaha, pango ia,UL 94V-0,reiti. Kāpeka:Phosphor Bronze,ia JIS 5210,0.2T Whakakikoruatia Hoapā:30u "koura whakakikorua i roto i te rohe whakapā me 100u" min.matte Tin i roto i te rohe whakapiringa, i runga i te whakapā katoa underplated ki 50u "min, Nika ki runga katoa. Rohe Solder:100u" matte Tin, 50u" min, Nikeli raro whakakikorua katoa.

Tuhono kāri CF 50P,L13.75mm,H3.9mm KLS1-CF-003

Whakaahua Hua Nga korero mo te kaari CF Tuhono 50P,L13.75mm,H3.9mm Rauemi: Whare:Thermoplastic,UL94V-V0.White. Whakapā: Copper Alloy 0.40T.Gold Flash On Contact Area Matte-Tin whakakikoruatia i runga i te hiku konuhono puta noa i te Nickel whakakikorua. Te whakatika: Copper Alloy 0.30T.Tin i whakakikoruatia ki runga i te hiku konuhono puta noa i te Nickel whakakikorua. Hiko: Whakatauranga o naianei: 0.5A AC,DC. Atete Whakapā:40mΩ Max. Ātete Wehenga: 1000MΩ Min. Te Ngaohiko: 500V AC/meneti Te Waahi Mahi: -45ºC~+85ºC

Tuhono kāri CF 50P,L26mm,H5.4mm KLS1-CF-002

Hua Ataahua Hua Korero Kaari CF Tuhono 50P,L26mm,H5.4mm Whare Rawa:LCP, UL94V-0 Hiko Whakatauranga o naianei: 0.5A,AC,DC Whakapā mai: 40mΩ max Te aukati Waihanga:1000ΜΩ min Tautuhia te ngaohiko: 500V AC/meneti Te Maama Mahi: -45ºC~+85ºC.

Tuhono kāri CF 50P,L26.9mm,H3.85mm KLS1-CF-001

Hua Ataahua Hua Korero Kaari CF Tuhono 50P,L26.9mm,H3.85mm Whare Taonga:LCP, UL94V-0 Hiko Whakatauranga o naianei: 0.5A,AC,DC Whakapā mai: 40mΩ max Te aukati aukati: 1000ΜΩ min Tautuhia te ngaohiko: 500V AC/meneti Te Maama Mahi: -85ºC ~ 45ºC.

SD 4.0 tūhono kāri KORE pana,H3.0mm KLS1-SD4.0-002 & KLS1-SD4.0-002A

Hua Whakaahua Hua Momohiohio Tuhono kaari SD 4.0 KORE pana,H3.0mm Rauemi: Insulator:LCP reanga,UL94V-0，Mapango. Hoapā:Phosphor Bronze.Tin 80u” Min i Solder Tail,Selectived Gold on Contact Area Plating. Anga:Stainless,Gold i Solder Tail,Over Nickel Plating. Hiko: Mahi Ngaohiko:10 VAC Max Whakatauranga o naianei:1 Amps Max. Whakapā Ātete:100mΩ Max 1000 DC Ātete ki te 50M. Te Ngaohiko: 500VAC/1 Minute Te mauroa: 10000 Cyc...

SD 4.0 tūhono kāri pana pana,H3.0mm,Whakamuri KLS1-SD4.0-001A

Whakaahua Hua Nga korero mo te hua SD 4.0 peera tuhono kaari,H3.0mm,Mahinga Whakamuri: Insulator:LCP reiti,UL94V-0，Mapango. Hoapā:Phosphor Bronze.Tin 80u” Min i Solder Tail,Selectived Gold on Contact Area Plating. Anga:Stainless,Gold i Solder Tail,Over Nickel Plating. Hiko: Mahi Ngaohiko:10 VAC Max Whakatauranga o naianei:1 Amps Max. Whakapā Ātete:100mΩ Max 1000 DC Ātete ki te 50M. Te Ngaohiko: 500VAC/1 Minute.

SD 4.0 tūhono kāri pana pana,H3.0mm KLS1-SD4.0-001

Hua Atahanga Hua Momohiohio SD 4.0 kaari tuhono pana pana,H3.0mm Rauemi: Insulator:LCP reiti,UL94V-0，Pango. Hoapā:Phosphor Bronze.Tin 80u” Min i Solder Tail,Selective Gold on Contact Area Plating. Anga:Stainless,Gold i Solder Tail,Over Nickel Plating. Hiko: Mahi Ngaohiko:500V(AC/DC) Naianei Whakatauranga:1.0A Waihanga Atete:1000MΩVDC i Dielect250VDC Min. Ngaohiko: 500VAC / 1 Minute Whakapā Atete: 100mΩ Max Hurihanga Mating:10000 Cycles &...

Tuhono kāri SD pana pana,H2.5mm KLS1-TF-020

Whakaahua Hua Hua Information Tuhono kāri SD pana pana,H2.5mm Rauemi: Whare:Hi-Temp kirihou,UL94V-0. Whakapā: Copper Alloy. Nail:Stainless Steel. Mutu: Whakapā:G/F Koura i whakakikoruatia ki te wāhi conatct; G/F whakakikoruatia i runga i nga hiku konutai, Base Nickel 50u” Min Nail:50u” Nickel Under,100u” Tin Overall.

Tuhono kāri SD pana pana,H2.5mm & H3.75mm KLS1-TF-006

Whakaahua Hua Hua Information Tuhono kāri SD pana pana,H2.5mm & H3.75mm Rauemi: Whare:Thermoplastic,UL94V-0.Natural. Kāpeka: Copper Alloy, Au Plating.Contact Area:G/F; Matte Tin Whakakikoruatia I runga Soldering. Anga:Stainless Steel. Hiko: Atete Whakapā:80mΩ Max. Ātete Wehenga: 100MΩ Min. Te Ngaohiko Korehiko: 500V AC. Ahuatanga Miihini Pupuri Pupuri:Min.100gf/Pin.

Tuhono kāri SD pana pana,H3.4mm,me te titi CD KLS1-TF-005S

Hua Whakaahua Hua Korero Tuhono kaari SD pana kume,H3.4mm,me te titi CD Rauemi: Insulator:Thermal Plastic UL94V-0 Hoapā: Copper Alloy Whakatakotoranga: Whakatauranga o naianei:1Amps Max Whakapā resistance:100mΩ Max. Te parenga whakaahuru:1000ΜΩ Min. Hurihanga Mating:10000 Cycles Minute. Te pāmahana mahi:-40ºC~+85ºC

Tuhono kāri SD pana pana,H3.4mm,me te titi CD KLS1-TF-005

Hua Ataahua Hua Korero Tuhono kaari SD pana pana,H3.4mm,me te titi CD Rauemi: Whare: Te Temehana Teitei Hoapapa Ngaaariki: Te Waa Parahi Whakaaturanga: Whakatauranga o naianei:0.5A Whakatauranga Ngaohiko:250VRM Whakapaa ki te parenga:100mΩ Max. Te parenga whakaahuru:100ΜΩ Min. Dielectric Withstanding Ngaohiko:500VAC Mating Cycle:10000 Cycles Minute. Te pāmahana mahi:-25ºC~+90ºC

Tuhono kāri SD pana pana,H2.75mm,me te titi CD KLS1-SD112

Hua Ataahua Hua Momohiohio Tuhono kaari SD pana kume,H2.75mm,me te titi CD Rauemi: Whare: Te Temehana Teitei Ngawha. Whakapā: Copper Alloy. Anga: Koraha Konukura, Whakakikoruatia te koura ki nga hiku konutai, Nickel Whakakikoruatia ki runga katoa. Whakakikoruatia: Rohe Whakapā: Whakakikoruatia te koura ki runga i a Ni. Tail Solder:30u” Min Sn Whakakikoruatia ki runga i te Ni. Hiko: Whakatauranga o naianei:0.5A. Whakatauranga Ngaohiko:250VRMS Whakapā Atete: 40mΩ Dielectric Tuturu Ngaohiko:500V AC. Te Whakataunga Ake: 100MΩ Te Mana Whakauru:4...

Tūhono kāri SD Waenganui, pana toia,H1.75mm,me CD Pin KLS1-SD003

Whakaahua Hua Hua Momoohio Tuhono Kaari SD i waenganui Maunga, pana kume,H1.75mm,me CD Pin Material: Whare:LCP S475,UL94V-0.Black. Anga:Stainless Steel SUS304. Whakapā: Copper Alloy C5210. Mutu: Whakapā:Gold Plated on Contact Area.Matte Tin 100u” Min On Soldertail Area.50u” Min Nickel Plating Overall. Anga:30u” Min Solderable Nickel Plating Overall.

Tuhono kāri SD pana pana,H2.8mm,me te titi CD KLS1-SD002

Hua Ataahua Hua Korero Tuhono kaari SD pana pana,H2.8mm,me te titi CD Rauemi: Whare:LCP,UL94V-0.Black. Kāpeka:C5191R-EH T=0.20,Whakapā G/F,Ni 40u”min,Solding Tin 80u WP Pin:C5191R-EH T=0.20,Contact G/F,Ni 40u”min,Solding Tin 80u CD Pin:C5191R-EH,TCon=0R-EH,TCon=0.EH,TCon=0.0.0000 min, Tiini Soldering 80u Anga:C2680-H,T=0.20,NI 40u” min. Hiko: Whakapā Whakatauranga o nāianei:0.5Amperes. Te Ngaohiko Korehiko: AC500V rms. Ātete Wehenga...

Tuhono kāri SD pana pana,H2.8mm,me te titi CD KLS1-SD-001 / KLS1-SD-101

Hua Ataahua Hua Moohiohio Tuhono kaari SD pana pana,H2.8mm,me te titi CD Rauemi: Insulator: Te Pawera Nui,UL94V-0. Whakapā:Copper Alloys.Plated 50u” Ni Overall Plated Au Selective Contact Area,Plated 100u”Sn Over Ni On Solder Area. Anga:Plated 50u” Ni Katoa. Hiko: Whakatauranga Ngaohiko:125V AC/DC Whakatauranga o naianei:0.5mA AC/DC Max. Ambient Humidity Range:95% RH Max. Whakapā Atete: 100mΩ Max. Waihanga Atete:1000MΩ Min./500V DC ...

5 i roto i te 1 Tuhono Kaari,H4.3mm KLS1-MUT51-001

Hua Whakaahua Hua Nga korero 5 i roto i te 1 Kaari Tuhono,H4.3mm Material Insulator:Hi-Temperature Kirihou,UL94V-0,Tae:Kapeka Pango:Copper Alloy,Select Gold Flash Whakakikorua I runga i te Rohe Whakapā,AND 50U”Min Nickel Underplated On Allover Shell:Stainless Stell,50u” Nickel Underplated On Allover,PulationGAD Kohikohiko I Solder00 min.AT DC 500V DC Whakaaetia ngaohiko:250V ACrms MO TE 1 Minute Whakapā atu: 100mΩ max.AT 10mA / 20mV max Ratin o naianei ...

Tuhono kāri SD moroiti pana pana,H1.5mm KLS1-TF-011-H1.5-R

Hua Whakaahua Hua Momohiohio Tuhono kaari Micro SD pana kume,H1.5mm

Micro SD 4.0 tūhono kāri pana pana,H1.3mm KLS1-SD4.0-003

Whakaahua Hua Hua Information Micro SD 4.0 kāri tūhono pana pana,H1.3mm Material: Insulator:Thermal Kirihou,Pated UL94V-0. Hoapā: Phosphor Bronze. Anga: Korewharewha. Whakakikoruatia Whakapā: Underplate:50u”-100u” Nickel Whakapā wāhi:Gold Flash Solder hiku rohe:100u”-200u” Tin Hiko: Ngaohiko Mahi:10V Whakatauranga o nāianei:0.5A Min. Atete Whakapā:100mΩ Max. Atete Mahinga: 1000MΩ Dielectric Te Ngaohiko Ngaohiko: 500VAC / 1 Minute. Nga Hurihuri Mating:...

Micro SD 4.0 tūhono kāri pana pana KLS1-SD4.0-004

Whakaahua Hua Hua Momoohio Micro SD 4.0 tuhono kaari pana pana Rauemi: Kirihou:LCP,Thermoplastic UL94V-0.Black. Whakapā: Copper Alloy. Anga:Stainless Steel. Whakakikoruatia: Rohe Whakapā:Au 3u” Neke atu i te Ni 50u”. Hohenga Hiko Hoko: Tiini He 80u” Min. Neke atu i te 50u”. Solderability: Neke atu i te whakakikorua Ni 50″ ki runga i te katoa.

Tuhono kāri SD moroiti pana pana,H1.28mm,me te titi CD KLS1-SD113

Hua Ataahua Hua Korero Tuhono kaari Micro SD te pana pana,H1.28mm,me te titi CD Rauemi: Insulator: Te Temperature Thermoplastic LCP SZ6505,UL94V-0,Black. Whakapā: Berylliun Copper (7035-TM06, T = 0.15mm), Whakakikoruatia 80u” min Ni whakakikoruatia katoa 1u” min Au ki runga Ni i runga i te rohe solder. Anga:SUS301-3/4H T=0.10mm.Sold hiku whakakikoruatia 1u” min Au overll 50u” min Ni. Hiko: Whakatauranga o naianei:0.5A AC/DC max. Ngaohiko Whakatauranga:12V AC/DC Ambient Haumākū Awhe:95% RH Max. ...
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