Hua

Tuhono kāri SD moroiti Momo Hined,H1.9mm KLS1-TF-017

Hua Whakaahua Hua Momo Tuhono kaari SD Micro Momo Hined,H1.9mm Rauemi: Insulator:High Temperature Thermoplastic Flammability Raring,UL94V-0,Black. Whakapā:Copper Alloys Uwhi:Stainless Steel Whakawhiti Rohe Whakakikorua:Gold voer Ni Solder Tail Coplanarity Me roto 0.10MAX.

Tuhono kāri SD moroiti pana pana,H1.4mm,me te titi CD KLS1-TF-016

Whakaahua Hua Hua Information Micro SD card tūhono pana pana,H1.4mm,ki CD titi Notes: 1.Coplanarity spec.for katoa solder teitei me te papa konohiko he 0.10mm 2.Electric āhuatanga: 2-1.Current Rating:0.5 Amp.max. 2-2.Ngaohiko:100V DC max. 2-3.Low taumata conatct resistance:100mΩ Max. 2-4.Dielectric Withstanding Voltage:AC500V rms. 2-5.Te Whakaaetanga Whakanui: 1000MΩ Min.(Whakamutunga)100MΩ Min. 3.Mechanical āhuatanga: 3-1.Durability:5000 Cycles. 3-2.Pamahana Mahi: -45ºC~+105ºC ...

Tuhono kāri SD moroiti pana pana,H1.42mm, me te titi CD KLS1-TF-015

Whakaahua Hua Hua Information Micro SD card tūhono pana pana,H1.42mm, ki te titi CD Material: Metal anga:Stainless Steel,Nickel whānui 50u” Housing:Liouid karaihe polymer,UL94V-0,Black. Whakapā terminals:Phosphor Bronze.Contact:Gold flash;Sold Tail:Gold 1u”Min. Rapua te Waahi:Phosphor Bronze.Contact:Gold flash;Sold Tail:Gold 1u" Min. Switch Terminal:Phosphor Bronze.Contact:Gold flash;Sold Tail:Gold 1u" Min.

Tuhono kāri SD moroiti pana pana,H1.8mm KLS1-TF-014

Whakaahua Hua Hua Information Tuhono kāri SD Micro pana kume, Teitei 1.8mm, Roro Pack. Rauemi: Whare:LCP,UL94V-0,Mapango. Kāpeka: Korotahi Korowai, Koura Whiriwhiria I Te Rohe Whakahoahoa. Anga: Rino Hiko: Whakatauranga Ngaohiko:5V Whakatauranga O Naianei:0.5 A Max. Atete Whakapā:100mΩ Max. Ātete Wehenga: 1000MΩ Min. Te Ngaohiko: 500V 1 Minute. Mauroa:10000 Cycles.

Tuhono kāri SD moroiti pana pana,H1.4mm,me te titi CD KLS1-TF-012

Hua Ataahua Hua Momoohio Tuhono kāri SD Micro pana pana,H1.4mm,me te titi CD Rauemi: Insulator: Te Temperature Thermoplastic,UL94V-0. Kāpeka: Copper Alloy,Plated 50u” Ni Overall. Whakakikoruatia Au Selective Contact Area Whakakikoruatia 100u” Sn Neke Ni I runga Solder Area. Anga:Plated 50u” Ni Katoa. Whakakikoruatia Au Selective Contact Area Hiko: Whakatauranga o naianei:0.5 A AC/DC max. Whakatauranga Ngaohiko:125V AC/DC Ambient Humidity Range:95% RH Max. Whakapā Atete:100mΩ Max Ins...

Tūhono Kāri SD Moroiti;Momo Hined,H1.5mm & H1.8mm KLS1-TF-007

Whakaahua Hua Hua Information Micro SD Card Hononga;Momo Hined,H1.5mm & H1.8mm Rauemi: Insulator:Hi-Temperature Kirihou,UL94V-0.Black. Kāpeka: Copper Alloy.AU Whakakikoruatia i runga i te wāhi whakapā kāpeka katoa, me te tine whakakikorua i runga i te wahi hiku konohiko. Anga:Stainless Steel. Hiko: Whakatauranga o naianei:0.5 He Whakatauranga Ngaohiko:5.0 vrms Te Whakaaetanga Whakanuia:1000MΩ Min./500V DC Ngaohiko Whakaaetanga:250V AC Mo te 1 meneti. Whakapā Atete: 100mΩ Max.AT 10mA/20mV Max Mahi Mahi: -45ºC~...

Waenganui Maunga Tuhono kaari SD Micro pana pana,H1.8mm, toua ki te titi CD KLS1-TF-003E

Hua Whakaahua Hua Momohiohio Waenganui Maunga Micro SD card tuhono pana pana,H1.8mm, toua ki te titi CD Rauemi: Whare: Te Pawera Nui, UL94V-0, Pango. Kāpeka: Copper Alloy . Anga: Korewharewha. Whakapā: Rohe Whakapā: Au G/F, Rohe Solder: Matte tin 80u” Min; I raro i te pereti Ni 30u” Min katoa. CD Pin: Horahanga Whakapā:Au G/F,I raro i te pereti Ni 30u” Min te katoa. Hiko: Naianei kua whakatauhia: 1.0 He Ngaohiko Whakatau: 30V Whakapā Atete50mΩ Max. Ātete Whakawera:100...

Tuhono kāri SD moroiti pana pana,H1.85mm,me te titi CD KLS1-TF-003D

Hua Ataahua Hua Momoohio Tuhono kaari SD Micro te pana pana,H1.85mm,me te titi CD Rauemi: Insulator: Te Temperature Thermoplastic,LCP,UL94V-0. Whakapā: Korohiko Alloy T = 0.15, Whakakikoruatia 50u "Ni Whakanuia. Whakakikoruatia Au Whiriwhiringa Whakawhiti Waa Whakakikoruatia 30u"-70u" Sn Neke atu i te Ni I runga Rohe Solder. Anga:T=0.15, Whakakikoruatia 30u" Ni Te katoa min. Whakakikoruatia 0.5u” Au Selective ContactArea Hiko: Whakatauranga o naianei:0.5mA amx. Whakatauranga Ngaohiko:3.3V Ambient Humidity Range:95% RH Max. Co...

Tuhono kāri SD moroiti pana pana,H1.85mm,me te titi CD,GOLD KLS1-TF-003C

Hua Ataahua Hua Momoohio Tuhono kaari SD Micro te pana pana,H1.85mm,me te titi CD,GOLD Rauemi: Insulator: Te Temperature Thermoplastic,LCP,UL94V-0. Whakapā: Korohiko Alloy T = 0.15, Whakakikoruatia 50u "Ni Whakanuia. Whakakikoruatia Au Whiriwhiringa Whakawhiti Waa Whakakikoruatia 30u"-70u" Sn Neke atu i te Ni I runga Rohe Solder. Anga:T=0.15, Whakakikoruatia 30u" Ni Te katoa min. Whakakikoruatia 0.5u” Au Rohe Whakapā Whiriwhiria. Hiko: Whakatauranga o naianei:0.5mA AC/DC amx. Whakatauranga Ngaohiko:125V AC/DC Ambient Humidity Ran...

Waenganui Maunga Tuhono kaari SD Micro te pana pana,H1.8mm,me te titi CD KLS1-TF-003A

Hua Whakaahua Hua Momohiohio Waenganui Maunga Micro SD tuhono kaari pana pana,H1.8mm,me te titi CD Rauemi: Insulator: Te Temperature Thermoplastic,UL94V-0. Whakapā: Korohiko Alloy ,Plated 50u” Ni Overall. Whakakikoruatia Au Selective Contact Area Whakakikoruatia 100u” Sn Over Ni I runga i Solder Area. Anga: Whakakikoruatia 50u” Ni Katoa. Whakakikoruatia 1u” Au Waahi Whakapaa Whiriwhiria. Hiko: Whakatauranga o naianei:0.5mA AC/DC amx. Ngaohiko Whakatauranga:125V AC/DC Ambient Humidity Range:95% RH Max. Whakapā atu ki a Resi...

Tuhono kāri SD moroiti pana pana,H1.85mm,me te titi CD KLS1-TF-003

Hua Ataahua Hua Momoohio Tuhono kāri SD Micro pana pana,H1.85mm,me te titi CD Rauemi: Insulator: Te Temperature Temperature Thermoplastic,UL94V-0. Whakapā: Korohiko Alloy T = 0.15, Whakakikoruatia 50u "Ni Whakanuia. Whakakikoruatia Au Whiriwhiringa Whakawhiti Waa Whakakikoruatia 30u"-70u" Sn Neke atu i te Ni I runga Rohe Solder. Anga:T=0.15, Whakakikoruatia 30u" Ni Te katoa min. Whakakikoruatia 0.5u” Au Rohe Whakapā Whiriwhiria Hiko: Whakatauranga o naianei:0.5 He Whakatauranga Ngaohiko:3.3V Awhe Haumākū Ahua:95% RH Max. Whakapā Re...

Tūhono Kāri SD Micro;Momo Hined,H1.9mm KLS1-TF-002

Hua Whakaahua Hua Momo Tuhono Kari SD Micro;Momo Hinengaro,H1.9mm Rauemi: Rauemi Whare: LCP UL94V-0 Rauemi Whakapā: Tin-Bronze Mōkī: Ripene me te Hurorirori Tauranga Hiko: Whakatauranga ngaohiko: 100V AC Whakatauranga o naianei: 0.5A ( Max Tuturu te ngaohiko: 200V AC / 1Minute ✉ parenga: 200V AC/1Minute ✉ Atete ✩ ≤30MΩ Te Ora: >5000 Huritaka Te Maama Mahi: -45ºC~+105ºC

Tuhono kāri SD moroiti pana pana,H1.85mm,Katia noa KLS1-TF-001B

Hua Whakaahua Hua Momohiohio Tuhono kaari Micro SD pana pana,H1.85mm,Katia katia Rawa: Whare:LCP,UL94V-0,Mapango. Whakapā: Phosphor Bronze. Anga:SUS304. Hiko: Atete Whakapā:100mΩ Max. Dielectric Withstanding Voltage:500V AC Max me te 1 Minute. Ātete Wehenga: 1000MΩ Min. Whakatauranga o nāianei: 0.5mA AC/DC max. Ngaohiko Whakatau:100V RMS Min. Te Kaha Whakahoahoa:13.8N Max. Te Kaha Whakakore:13.8N Min. Whakapā Atete Force:100g Min.Per Pin. Te Waahi Mahi: -45ºC~+...

Tuhono kāri SD moroiti pana pana,H1.85mm,Katia noa KLS1-TF-001

Hua Ataahua Hua Momoohio Tuhono kaari SD Micro pana pana,H1.85mm,Katia katia Rawa: Whare: Te Pawera Nui,UL94V-0,Mapango. Whakapā: Copper Alloy . Anga:Stainless Steel,Nickle. Tauira: Korowaiwai, Nika. Puna:Pianowire, Nickle. Whakakikoruatia: Underplate:Nickel. Wāhi Whakapā: Koura i runga i te Nickel. Rohe Solder:Tina ki runga nika.

Tūhono Kāri Sim Taurua, PUSH PULL, H3.0mm KLS1-SIM2-002A

Ataahua Hua Nga korero Hua Tuhono Kaari SIM Rua, PUSH PULL,H3.0mm Rauemi: Whare:Hi-TEMP Kirihou,UL94V-0.Black. Kāpeka: Copper alloy Anga:Stainless Steel Mutu: Kapeka: Au Whakakikoruatia ki runga i te rohe whakapā , Matte tine whakakikoruatia i runga i nga hiku konohiko i raro i runga i te nickel Anga:Au i whakakikoruatia ki runga i nga hiku konohi i whakakikoruatia ki runga i te nickel Hiko: Whakapā Atete: 50mΩ Max Tuturu Ngaohiko:350V AC rms mo te 1 miniti...

2 I roto i te 1 Micro Sim me te Tuhono Kari SD, 8P,H2.26mm KLS1-SIM-109

Whakaahua Hua Nga Korero Hua 2 I roto i te 1 Micro SIM & Tuhono Kaari SD, 8P,H2.26mm Rauemi: Insulator: High Temp Thermoplastic,UL94V-0.Black. Kāpeka: Copper Alloy,Gold whakakikorua i roto i te wāhi whakapā 1u",Solding Area gilding 1u"Upper Anga:Stainless Steel,Plate Nickel 50u". Raro Anga:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u". Te Hiko: Te Mana Whakauru 1kgf Max.Te Kaha Tango 0.1kgf Min. Mauroa:Sim 5000 Cycles, Whakapā Atete: I mua i te whakamatautau 80mΩ Max, Muri...

Tūhono Kāri Sim Taurua, PUSH PULL, H3.0mm KLS1-SIM-033

Whakaahua Hua Nga korero Hua Tuhono Kaari SIM Rua, PUSH PULL,H3.0mm Rauemi: Whare:Hi-Temperature Kirihou,UL94V-0.Black. Kāpeka: Copper Alloy.Gold Flash Whakakikoruatia I runga katoa Kāpeka, ME 50u "Min Nickel Underplated I Allover. Anga:Stainless Steel.50u" Nickel Underplated I Allover,Gold Flash I Solder PAD. Hiko: Whakatauranga o naianei:0.5 A. Whakatauranga Ngaohiko:5.0 vrms. Ātete Waihanga:1000MΩ Min.At DC500V DC. Te Ngaohiko: 250V AC RMS Mo te 1 Minute. Whakapā...

2 I roto i te 1 Kaari Sim +Tuhono SD Micro, PUSH PULL,H2.7mm KLS1-SIM-024

Whakaahua Hua Nga korero mo te hua 2 I roto i te 1 Kaari Sim +Tuhono SD Micro, PUSH PULL,H2.7mm Hiko: Ngaohiko:100V AC Naianei:0.5A Max. Atete Whakapā:100mΩ Max. Te Ngaohiko Korehiko: 500V AC. Ātete Mahinga: 1000MΩ Min Miihini: Te Kaari Whakauru Whakaaetanga Kaha:13.8N Max. Pana ki te Kaha:19.6N Max. Mauroa:10000 Cycles. Te Waahi Mahi: -45ºC ~ + 85ºC Hiko: Ngaohiko: 100V AC Naianei: 0.5A Max. Atete Whakapā:100mΩ Max. Korehiko Tuturu...

Tūhono Kāri Sim Nano;PUSH PULL,6Pin,H1.40mm KLS1-SIM-113

Whakaahua Hua Hua Momoohio Tuhono Kaari SIM Nano;PUSH PULL,6Pin,H1.40mm Rauemi: Insulator:LCP,UL94V-0. Whakapā:C5210.Plated 50u” Ni Overall,Contact All Au 1u.Anga:SUS,Plated 50u”Ni Overall,PAD Au 1u. Hiko: Whakatauranga o naianei:0.5A AC/DC max. Whakatauranga Ngaohiko:30V AC/DC Whakapā Atete:30mΩ Max. Ātete Mahinga: 1000MΩ Min Te Mahi Mahi: -45ºC~+85ºC

Tūhono Kāri Sim Nano, PUSH PUSH, 6Pin, H1.37mm, me te CD Pin KLS1-SIM-066

Ataahua Hua Nga korero mo te Tuhono Kaari SIM Nano, PUSH PUSH, 6Pin, H1.37mm, me te CD Pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Whakapā: Copper Alloy, Whakakikoruatia 50u” Ni Overall, PAD Au 1u”. Anga:SUS.Katoa Ni 30U/MIN. Hiko: Whakatauranga o naianei:0.5A ampers Whakatauranga Ngaohiko:5V AC/DC Whakapā Atete:100mΩ Max. Ātete Wehenga: 1000MΩ Min./500V DC Te Mahi Mahi: -45ºC~+85ºC

Tūhono Kāri Sim Nano, PUSH PUSH, 6Pin, H1.25mm, me te CD Pin KLS1-SIM-103

Whakaahua Hua Hua Momohiohio Nano Sim Card Hononga,PUSH PUSH,6Pin,H1.25mm,me CD Pin Material: Whakapā:Copper Alloy.Au ki runga Ni. Whare: LCP Kii Kaata. Anga:Stainless.Au i runga i te Ni.GND Anga:Copper Alloy.Au i runga i te Ni. Whakawhiti Rapu: Copper Alloy.Au i runga i te Ni.Slide: Pa10t kua whakakiia te karaihe. Puna:Korekau. Matau:Korekau. Hiko: Whakatauhia o naianei: 0.5A Max Whakataunga Ngaohiko: 30V AC Whakapā Atete:100mΩ Max. Ātete Mahinga: 1000MΩ Min./500VDC Dielectric Tuturu Ngaohiko:500...

Tūhono Kāri Sim Nano,Momo Paepae,6Pin,H1.55mm,me CD Pin KLS1-SIM-104

Ataahua Hua Nga korero Hua Tuhono Kaari SIM Nano,Momo Paepae,6Pin,H1.55mm,me CD Pin Hiko: Whakatauranga o naianei:1 Amp/Pin.MAX. Ngaohiko:30V DC.MAX Taumata Iti Whakapā Atete:30mΩ Max.I te tuatahi. Dielectric Withstanding Voltage:500V AC MIN.Mo te 1 meneti. Atete Whakanui: 100MΩ Min.500V DC .Mo te 1 meneti. Mauroa:1500 Cycles. Te Mahi Mahi: -45ºC~+85ºC

Tūhono Kāri Sim Nano,Momo Paepae,6Pin,H1.5mm,me CD Pin KLS1-SIM-102

Whakaahua Hua Hua Momohiohio Tuhono Kaari SIM Nano,Momo Paepae,6Pin,H1.5mm,me CD Pin Hiko: Whakatauranga o naianei:1 Amp/Pin.MAX. Ngaohiko:30V DC.MAX Taumata Iti Whakapā Atete:30mΩ Max.I te tuatahi. Dielectric Withstanding Voltage:500V AC MIN.Mo te 1 meneti. Atete Whakanui: 100MΩ Min.500V DC .Mo te 1 meneti. Mauroa:1000 Cycles. Te Mahi Mahi: -45ºC~+85ºC

Tūhono Kāri Sim Nano;Momo Paepae Maunga Waenganui,6Pin,H1.5mm,me CD Pin KLS1-SIM-100

Whakaahua Hua Hua Momohiohio Tuhono Kaari SIM Nano;Momo Paepae Maunga MID,6Pin,H1.5mm,me te CD Pin Material: Kirihou:LCP,UL94V-0.Black. Whakapā:C5210 Anga:SUS304 Paepae:LCP,UL94V-0.Black. Whakakikoruatia: Whakapā:Waihanga Whakapā:G/F Whakakikorua;Soldertail Area:80u” Matte Tin Anga:Plating over 30u”Ni Solderable 30u”Ni Whakakikoruatia ki runga katoa.Contact and hiku coplanarity to be 0.10mm all.