Nga korero mo te hua Tuhono Kaari Sim Rua, PUSH PULL, H3.0mm Rauemi: Whare:Hi-TEMP Kirihou,UL94V-0.Black. Kāpeka: Copper alloy Anga:Stainless Steel Mutu: Kapeka: Au i whakakikoruatia ki runga i te waahi whakapiri , Matte tine whakakikoruatia ki runga i nga hiku konuhia i raro i runga i te nickel Anga:Au i whakakikoruatia ki runga i nga hiku konupuku i whakakikoruatia ki runga i te nickel.
2 I roto i te 1 Micro Sim me te Tuhono Kari SD, 8P,H2.26mm KLS1-SIM-109
Nga korero mo te hua 2 I roto i te 1 Micro SIM & Tuhono Kaari SD, 8P,H2.26mm Rauemi: Insulator: High Temp Thermoplastic,UL94V-0.Black. Kāpeka: Korohiko Alloy,Gold whakakikorua i roto i te rohe whakapā 1u",Solding Area whakakikoruatia 1u"Upper Anga:Stainless Steel,Rite Nickel 50u". Raro Anga:SUS304 R-1/2H T=0.10mm,Plate Nickel 50u". Te Hiko: Te Mana Whakauru 1kgf Max.Te Kaha Tango 0.1kgf Min. Mauroa: SIM 5000 Cycles, Whakapā Atete: I mua i te whakamatautau 8...
Nga korero mo te Hua Tuhono Kaari SIM Rua, PUSH PULL,H3.0mm Rauemi: Whare:Hi-Temperature Kirihou,UL94V-0.Black. Kāpeka: Copper Alloy.Gold Flash Whakakikoruatia i runga i te katoa Kāpeka, ME 50u "Min Nickel Underplated On Allover. Anga:Stainless Steel.50u" Nickel Underplated I Allover,Gold Flash On Solder PAD. Hiko: Whakatauranga o naianei:0.5 A. Whakatauranga Ngaohiko:5.0 vrms. Ātete Waihanga:1000MΩ Min.At DC500V DC. Ngaohiko Tuturu: 250V AC RMS Mo te 1 ...
Tūhono Kāri Sim Nano, PUSH PUSH, 6Pin, H1.37mm, me te CD Pin KLS1-SIM-066
Hua Information Nano Sim Card Hononga,PUSH PUSH,6Pin,H1.37mm, with CD Pin Material: Insulator: High Temperature Thermoplastic,UL94V-0. Whakapā: Copper Alloy, Whakakikoruatia 50u" Ni Overall, PAD Au 1u". Anga:SUS.Katoa Ni 30U/MIN. Hiko: Whakatauranga o naianei:0.5A ampers Whakatauranga Ngaohiko:5V AC/DC Whakapā Atete:100mΩ Max. Te Whakaaetanga Whakanui: 1000MΩ Min./500V DCOperating Temperature: -45ºC~ + 85ºC Wāhanga Nama Whakaahua PCS / CTN G ...
Tūhono Kāri Sim Nano, PUSH PUSH, 6Pin, H1.25mm, me te CD Pin KLS1-SIM-103
Hua Information Nano Sim Card Connector,PUSH PUSH,6Pin,H1.25mm, with CD Pin Material: Contact:Copper Alloy.Au over Ni. Whare: LCP Kii Kaata. Anga:Stainless.Au i runga i te Ni.GND Anga:Copper Alloy.Au i runga i te Ni. Whakawhiti Rapu: Copper Alloy.Au i runga i te Ni.Slide: Pa10t kua whakakiia te karaihe. Puna:Korekau. Matau:Korekau. Hiko: Whakatauhia o naianei: 0.5A Max Whakataunga Ngaohiko: 30V AC Whakapā Atete:100mΩ Max. Ātete Wehenga:1000MΩ Min./500VDC Dielectric Wi...
Tūhono Kāri Sim Nano,Momo Paepae,6Pin,H1.5mm,me CD Pin KLS1-SIM-102
Nga korero mo te hua Nano Sim Card Connector,Momo paepae,6Pin,H1.5mm,me CD Pin Hiko: Whakatauranga o naianei:1 Amp/Pin.MAX. Ngaohiko:30V DC.MAX Taumata Iti Whakapā Atete:30mΩ Max.I te tuatahi. Dielectric Withstanding Voltage:500V AC MIN.Mo te 1 meneti. Atete Whakanui: 100MΩ Min.500V DC .Mo te 1 meneti. Te Maamaa: 1000 Cycles. Te Maama Mahi: -45ºC ~ + 85ºC Wāhanga Nama Whakaahua PCS / CTN GW(KG) CMB(m3) OrderQty. Whakaritea Wā...
Tūhono Kāri Sim Nano;Momo Paepae Maunga Waenganui,6Pin,H1.5mm,me CD Pin KLS1-SIM-100
Hua Information Nano Sim Card Connector;MID Mount Tray momo,6Pin,H1.5mm, with CD Pin Material: Plastics:LCP,UL94V-0.Black. Whakapā:C5210 Anga:SUS304 Paepae:LCP,UL94V-0.Black. Whakakikoruatia: Whakapaa: Whakapiri Rohe:G/F Whakakikorua; Soldertail Area:80u" Matte Tin Anga: Plating over 30u" NiSolderable 30u" Ni Plating over all.Contact and tail coplanarity to be 0.10mm all. Part No. Whakaahuatanga PCS/CTN GW(KG) CMB(m3) OrderQty. Time
Tūhono Kāri SIM Nano,6Pin,H1.4mm,Momo Hined,me CD Pin KLS1-SIM-101
Hua Information Nano Sim Card Hononga,6Pin,H1.4mm,Momo Hined,me CD Pin Material: Whare: Temperature High Thermoplastic,UL94V-0.Black. Kāpeka: Koraha Konukura, Whakakikoruatia te Koura i runga i te waahi whakapiri me nga hiku konohi, Nickel Whakakikoruatia ki runga katoa. Anga:Stainless Steel, Whakakikoruatia ki te koura i runga i nga hiku konutai, Nickel whakakikoruatia ki runga katoa. Hiko: Whakatauhia o naianei: 0.5A Max Whakataunga Ngaohiko: 30V AC Whakapā Atete:100mΩ Max. Ātete Wehenga:1000MΩ Min./500V...
Tūhono Kāri SIM Nano,6Pin,H1.4mm,Momo Hined,me CD Pin KLS1-SIM-077A
Hua Information Nano Sim Card Hononga,6Pin,H1.4mm,Momo Hined, with CD Pin Material: Insulator: Temperature High Thermoplastic,UL94V-0. Whakapā: Korohiko Alloy, Whakakikoruatia 50u" Ni Whakatairanga Whakapā Katoa Au 1U. Anga:SUS.Katoa Ni 30U MIN. Hiko: Whakatauranga o Naianei:0.5A AC/DC MAX. Whakatauranga Ngaohiko:125V AC/DC Awhe Haumākū Awhiowhio:95% RH Max. Whakapā Atete:80mΩ Max. Nga Hurihanga Mating: 5000 Nga Whakauru Mahi ...
Tūhono Kāri SIM Nano, PUSH PULL, 6Pin, H1.4mm, me te CD Pin KLS1-SIM-092
Hua Information Nano Sim Card Connector,PUSH PULL,6Pin,H1.4mm, with CD Pin Material: Whare:Hi-Temperature Thermoplastic,UL94V-0.Black. Kāpeka: Copper Alloy,whiriwhiri 1u" Au i runga i te rohe whakapā. Anga:Stainless Steel.selective Gold Flash i runga i te rohe solder. Hiko: Rated nāianei:0.5A Max Whakataunga Ngaohiko:30V AC Whakapā Ātete: 100mΩ Max. Waihanga Ātete: 1000MΩ Min./500V DC AC/500V DC Dielectric Withstanding Voltage.
Moohio Hua Tuhono Kaari Moroiti, 6P, PUSH PULL, H1.5mm Whare Rawa: Thermoplastic, UL94V-0. Kāpeka: Korohiko Koro, Whakakikoruatia ki te Koura i runga i te Rohe Whakapā me nga Hiko Hoahoa, Whakakikoruatia te Nikeli. Anga:Stainless Steel.Nickel Plated Overall.GoldPlated on Solder Tails. Hiko: Whakatauranga o naianei:1.0 A max. Atete Whakapā:30mΩ Max. Te Ngaohiko Whakaaetanga Dielectric: 500V AC Whakaaetanga Whakanuia: 1000MΩ Min./500V DC Te Mahi Mahi: -45ºC~+8...
Hua Information Micro Sim Card Connector,6P,H1.45mm Material: Insulator:Hi-Temperature Kirihou,UL94V-0.Black. Kāpeka: Copper Alloy,50u" min Nickel underplated onallover,gole plated allover. Anga:Stainless Steel,50u" Nickel underplated onallover,gole flash on solder latch. Hiko: Whakatauranga o naianei:0.5 He Whakatauranga Ngaohiko:5.0 V Te Whakaaetanga Whakanui: 500MΩ Min./500V DC Ngaohiko Whakaaetanga:250V AC Mo te 1 meneti. Ātete Whakapā:100mΩ ...