Waenga o Maunga USB Momo-C 16P IPX7 Tūhono parewai
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Waenga o Maunga USB Momo-C 16P IPX7 Tūhono parewai
Rauemi:
Whare: Nylon Kirihou
Neke atu i te Molding1:Nilon Kirihou
Pereti Solder: SUS304 Whakakikoruatia nga Solders Nickel
Āhuatanga Hiko:
Ngaohiko / Whakatauranga Naianei: 4V / 3.0A
Te Ngaohiko Korehiko: 100VAC
Paemahana: -30%%DC~+ 85%%DC
Atete Whakapā: 40mΩ Max
Ātete Insulator: 100MΩ Min
Te Mana Whakauru Tuatahi: 5-20N;
Te Mana Tango: 8-20N
I muri i te mauroa: 10000 Cycles,
Te Mana Whakauru: 5-20N ,Te Mana Tango:6-20N
Koeke parewai:IP67
Ingoa Hua | Tuhono USB |
Tiwhikete | ISO9001, ISO14000, ROHS, REACH |
MOQ | Ka taea te whakaae ki te ota iti |
Taupānga | Ka whakamahia nui i roto i nga taputapu waea, rorohiko |
Mōkī | Whakauruhia ki roto i te kaata paerewa kaweake me te raarangi whakakai me te tohu kaipuke |
Tauira | Mo te kore utu |
Momo Utu Whakaae | T / T, Kaari nama, PayPal, Western Union |
Nga Whakaaetanga Tukunga | FOB, CIF, EXW |
Tukunga | Puka hua i roto i te 3 nga ra mahi |
Nga hua kua whakaritea a tawhio noa7 nga ra mahi |
Kaihanga Ngaio o USB parewai 3.1 Momo C Wahine 16P SMT Hononga IPX7 | |
1. MATERE: | |
1-1. ANGA WAHO: | SUS301-1/2H T=0.20mm |
1-2.ANGA ROTO: | SUS301-1/2H T=0.20mm |
1-3. Tohu: | SUS301-H T=0.10mm |
1-4.RFI PAD: | SUS301-H T=0.10mm |
1-5.WHARE: | LCP+30%GF UL94 V-0 PANGO |
1-6.TEMINARL: | KAUPAPA KAUPAPA C19400-HT=0.10mm |
2.PLATING SPECIFICATION | |
2-1.TERMINAL: | WHAKAARO KOURA. |
2-2.ANGA: | 60μ" MIN. |
3. WHAKAMAHI MAHI | |
3-1. TE WHAKAMAHI KAUPAPA: | 5N~20N. |
3-2.WAHA WEHI: | 8N~20N TMATAMATA, I muri i te 1000 NGA POORA KAUPAPA 6N~20N. |
3-3.TAMARANGA: | 10000 CYCLES. |
4. WHAKAMAHI HIKO | |
4-1.Whakatauranga o naianei: | 3A. |
4-2.LLCR: WHAKAPAKI: | 40mΩ MAX(KOREUTU). |
4-3.ARANGA WHAKATAKI: | KAUPAPA KAUPAPA: 100MΩ MIN. |
4-4.DIELECTRIC ATU NGAOHIA: | 100V/AC. |
5.IR REFLOW: | |
KO TE PANAMAHA O TE PEAK I RUNGA I TE PAPA KA WHAKAPUIA MO TE 10 HEkona KI TE 260±5°C. | |
6. WHAKAMAHI WHAKAMAHI: -55°C~105°C. | |
7.RoHS WHAKATOKANGA RĀNEI HALOGEN KOREUTU. |
Kaihanga Ngaio o USB parewai 3.1 Momo C Wahine 16P SMT Hononga IPX7 | |
1. MATERE: | |
1-1. ANGA WAHO: | SUS301-1/2H T=0.20mm |
1-2.ANGA ROTO: | SUS301-1/2H T=0.20mm |
1-3. Tohu: | SUS301-H T=0.10mm |
1-4.RFI PAD: | SUS301-H T=0.10mm |
1-5.WHARE: | LCP+30%GF UL94 V-0 PANGO |
1-6.TEMINARL: | KAUPAPA KAUPAPA C19400-HT=0.10mm |
2.PLATING SPECIFICATION | |
2-1.TERMINAL: | WHAKAARO KOURA. |
2-2.ANGA: | 60μ" MIN. |
3. WHAKAMAHI MAHI | |
3-1. TE WHAKAMAHI KAUPAPA: | 5N~20N. |
3-2.WAHA WEHI: | 8N~20N TMATAMATA, I muri i te 1000 NGA POORA KAUPAPA 6N~20N. |
3-3.TAMARANGA: | 10000 CYCLES. |
4. WHAKAMAHI HIKO | |
4-1.Whakatauranga o naianei: | 3A. |
4-2.LLCR: WHAKAPAKI: | 40mΩ MAX(KOREUTU). |
4-3.ARANGA WHAKATAKI: | KAUPAPA KAUPAPA: 100MΩ MIN. |
4-4.DIELECTRIC ATU NGAOHIA: | 100V/AC. |
5.IR REFLOW: | |
KO TE PANAMAHA O TE PEAK I RUNGA I TE PAPA KA WHAKAPUIA MO TE 10 HEkona KI TE 260±5°C. | |
6. WHAKAMAHI WHAKAMAHI: -55°C~105°C. | |
7.RoHS WHAKATOKANGA RĀNEI HALOGEN KOREUTU. |
Hua Ritenga
Ngā Tuhituhi: PDF
Korero: E ai ki to tuhi (rahi, roa, teitei, titi, tikanga whakapiri, aha atu)
Taputapu Whakamatau: Miihini Miihini, Miihini Whakarere Hiko, Miihini Miihini, Reflow Soldering, Miihini Injection, Miihini pehi, Miihini Huihui Aunoa etc.
To Tatou Painga
1.24 haora te ratonga ipurangi me te korero tere / tuku.
2.100% QC te tirotiro i te kounga i mua i te tuku, ka taea te whakarato i te puka tirotiro kounga.
3.12 tau o te wheako i roto i te rohe hono me te whai i tetahi roopu hoahoa matua ki te tuku whakaaro whakarereke tino pai.
4.kotahi-mutu ratonga.
Tarapu & Tukunga
1.Arrange tarapēke i roto i 24 haora, wa tuku i roto i 7-12days
2.Kaore he utu atu, He pai te punaha i muri i te hoko, Te tautoko i nga haerenga ki te wheketere
3.100% i tirohia i mua i te tuku
4.o nga hua he tiwhikete ROHS
5.whakaaehia te tauhokohoko hokohoko / raruraru kounga ka hoki mai me te whakahoki