KAUPAPA KAUPAPA MICRO USB MOMO B Solder KLS1-235-3
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Taipitopito Hua
Tohu Hua
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| Rauemi: Whare:LCP ,UL94V-0 Pango. Whakapā: Phosphor Bronze,T=0.20±0.01mm. Anga o Mua:Stainless Steel,T=0.20±0.01mm. Anga Whakamuri:Stainless Steel,T=0.20±0.01mm. Pikitia: Korekau, T=0.40±0.01mm. Mutunga: Nga Hoapā: Ka whiti te koura, i runga i te rohe Whakapā. 100u-120u" Tin.Plating, i runga i nga hiku solder. 50u-80u" Nickel, Whakakikoruatia ki runga katoa. Hiko: Whakatauranga o naianei:1A Max. Ngaohiko Tuturu Dielectric: 500 VAC Minute tawhiti. Atete Whakapā:30mΩ Max. Ātete Wehenga:1000MΩ Min i DC 500V. Paemahana:-55°C KI +105°C. |
| Wahi No. | Whakaahuatanga | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Te wa | Ota |
