WHAKATOKANGA MONO MICRO USB MOMO B Solder T3.0,L8.8mm KLS1-235-2
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| Rauemi Whare:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā: Copper Alloy C2680. Anga: Korowai Waa C2680/SPCC. Mutu: Whakapā: Whakakikoruatia te koura i roto i te rohe kahui; Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.5A/Taka Whakapā. Whakatauranga Ngaohiko:30V DC Atete Whakapā:30mΩ Max. Ngaohiko Tuturu Dielectric: 500 V AC AT Taumata Moana. Ātete Wehenga: 1000MΩ Min. Hoa Tuhono me te Kaha Kore i Hoa Mate Force:3.75kgf Max. Te Kaha Korekau:1.02kgf Min. Pupuri Pupuri:1.2kgf Min. |
| Wahi No. | Whakaahuatanga | PCS/CTN | GW(KG) | CMB(m3) | OrderQty. | Te wa | Ota |
