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Tuhono USB moroiti

MICRO USB 3.0 Wahine,10P SMD KLS1-234-10F3

Rauemi Moohio Hua: Whare:LCP,UL94V-0 Whakapā: Korohiko Alu. Te Whakakikorua Koura AT Waa Whakapaa Te Whakakikoruatanga Tin ki nga Hiko. Anga:SUS304.Tin Whakakikoruatia Hiko: Whakapaa Whakatauranga o naianei: 1.0A Max. Atete Whakapā: 30m? Max. Ātete Wehenga: 100M? Min. Te Ngaohiko Korehiko: 100V AC RMS Te Mahi Mahi:-30°C ~ +80°C. Nga Ahuatanga Miihini: Te Mating Force: 3.5kgf Max. Te Mana Whakakore: 1.0kgf Min. Dura...

MICRO USB 3.0 Wahine,10P Poutū SMD KLS1-234-10F2

Rauemi Moohio Hua: Whare:LCP,UL94V-0 Whakapā: Korohiko Alu. Te Whakakikorua Koura AT Waa Whakapaa Te Whakakikoruatanga Tin ki nga Hiko. Anga:SUS304.Tin Whakakikoruatia Hiko: Whakapā Whakatauranga o nāianei: 1.5A Max. Atete Whakapā: 30m? Max. Ātete Wehenga: 100M? Min. Te Ngaohiko Korehiko: 100V AC RMS Te Mahi Mahi:-20°C ~ +60°C. Nga Ahuatanga Miihini: Te Mating Force: 3.5kgf Max. Te Mana Whakakore: 1.0kgf Min. Dura...

MICRO USB 3.0 Wahine,10P SMD KLS1-234-10F1

Rauemi Moohio Hua: Whare:LCP,UL94V-0 Whakapā: Korohiko Alu. Te Whakakikorua Koura AT Waa Whakapaa Te Whakakikoruatanga Tin ki nga Hiko. Anga:SUS304.Tin Whakakikoruatia Hiko: Whakapaa Whakatauranga o naianei: 1.0A Max. Atete Whakapā: 30m? Max. Ātete Wehenga: 100M? Min. Te Ngaohiko Korehiko: 100V AC RMS Te Mahi Mahi:-30°C ~ +80°C. Nga Ahuatanga Miihini: Te Mating Force: 3.5kgf Max. Te Mana Whakakore: 1.0kgf Min. Dura...

MICRO USB 3.0 MONO,10P Solder KLS1-234-10M1

Rauemi Momo Hua: Whare:Thermoplastic,UL94V-0 Whakapā: Copper Alloy. Anga:SUS201. Whakakikoruatia: Whakakikoruatia:Te Whakakikorua Koura Tirohia te Ripanga AT Te Waa Whakapaa Te Whakakikorua Tiina AT Waahi Solder. Nickel Under whakakikoruatia Katoa. Anga:Sold Nickel Plated on All Over. Hiko: Te Mahi Mahi:-20°C KI +80°C. Wāhanga Nama Whakaahua PCS/CTN GW(KG) CMB(m3) OrderQty. Te Whakataunga Wa

KAUPAPA KAUPAPA MICRO USB MOMO B CLIP KLS1-236-5M8

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā:C2680/C5191. Anga: Steel. Mutu: Whakapā:Plated Gold In Mating Area; Tiini Arataki I runga Solder Talls. Anga: Te Whakakikorua Tiini. Hiko: Tautoko Whakapā:30mΩ Max. Te Ngaohiko Whakaaetanga Dielectric: 50 V AC AT Taumata Moana. Ātete Wehenga: 100MΩ Min. Wāhanga Nama Whakaahua PCS/CTN GW(KG) CMB(m3) OrderQty. Tikanga Wā...

KAUPAPA KAUPAPA MICRO USB MOMO B CLIP L8.8 KLS1-236-5M7

Nga Moohiohio Hua Whare:Hing Temperature Thermoplastic with gf,UL94V-0. Whakapaa: Koroha Konukura, t=0.20mm. Anga:SUS,t=0.20mm. Hiko: Whakatauranga o naianei:1A Max. Te Ngaohiko Korehiko: 100 V AC mo te 1 min. Atete Whakapā:50mΩ Max. Ātete Wehenga: 100MΩ Min. Tapeke Mating Force:3.57 kgf Max. Katoa Te Mana Whakakore: 1.0 kgf Min. Paemahana: -30°C Ki runga ki te +80°C Wahi Nama Whakaahuatanga PCS/CTN GW ..

KAUPAPA KAUPAPA MICRO USB MOMO B CLIP L6.8 KLS1-236-5M6

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastic with gf,UL94V-0. Whakapaa: Koroha Konukura, t=0.20mm. Anga:SUS,t=0.20mm. Hiko: Whakatauranga o naianei:1A Max. Te Ngaohiko Korehiko: 100 V AC mo te 1 min. Atete Whakapā:50mΩ Max. Ātete Wehenga: 100MΩ Min. Tapeke Mating Force:3.57 kgf Max. Katoa Te Mana Whakakore: 1.0 kgf Min. Te Paemahana: -30°C Tae atu ki te +80°C Wahi No. Descripti...

KAUPAPA KAUPAPA MICRO USB MOMO B SMD KLS1-236-5M3

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā:C2680/C5191. Anga: Konohi/rino/ kowiri tira. Mutu: Whakapā:Plated Gold In Mating Area; Tiini Arataki I runga Solder Talls. Anga: Te Whakakikorua Tiini. Hiko: Tautoko Whakapā:30mΩ Max. Te Ngaohiko Whakaaetanga Dielectric: 50 V AC AT Taumata Moana. Ātete Wehenga: 100MΩ Min. Wāhanga Nama Whakaahua PCS/CTN GW(KG) CMB(m3) Ord...

KAUPAPA KAUPAPA MICRO USB MOMO B SMD KLS1-236-5M2

Rauemi Momo Hua: Whare:Hing Temperature Kirihou, UL94V-0, Pango. Whakapā:C2680/C5191. Anga: parahi. Mutu: Whakapā:Plated Gold In Mating Area; Tiini Arataki I runga Solder Talls. Anga:Nickel Plating. Hiko: Tautoko Whakapā:30mΩ Max. Ātete Wehenga: 100MΩ Min. Wāhanga Nama Whakaahua PCS/CTN GW(KG) CMB(m3) OrderQty. Te Whakataunga Wa

WHAKATOKANGA MONO MICRO USB MOMO B PCB MID MOUNT KLS1-236-5M1

Nga Taonga Momo Momo Whare:LCP,UL94V-0,Mapango. Whakapā: Copper Alloy. Anga:SUS 304 T=0.20. Mutu: Whakapā:Gold Plating on Contact area. 80u" Sn Whakakikoruatia i runga i te waahi hiku solder. 50u" Min.Nickel I raro i te whakakikorua ki runga katoa. Hiko: Whakatauranga Ngaohiko:30VAC RMS. Whakatauranga o naianei:2.0A(pin 1 5); 1.0A(pin 2 3 4). Atete Whakapā:50mΩ Max. Ātete Wehenga: 100MΩ Min. Te Ngaohiko Whakaaetanga Dielectric: 500 V AC Mo ...

KAUPAPA KAUPAPA MICRO USB Solder KLS1-235-5

Rauemi Momo Hua: Whare:LCP E130,UL94V-0 Pango Whakapā:Parahi 5210. Anga:Stainless Steel,T=0.20±0.03mm. Whakakikoruatia: Whakapā: Whakakikoruatia te Korama Koura Mo te Rohe Whakapā. Anga:Nickel Over All (te rehu tote mo te 24H). Anga:Gold Over All (te rehu tote mo te 24H). Hiko: Te Mahi Mahi:-20°C KI +80°C. Hua E tika ana ki te tono RoHS Wahi Nama Whakaahuatanga PCS/CTN GW(KG) CMB(m3) OrderQty. Te Whakataunga Wa

KAUPAPA KAUPAPA MICRO USB MOMO B Solder KLS1-235-3

Rauemi Korero Hua: Whare:LCP ,UL94V-0 Pango. Whakapā: Phosphor Bronze,T=0.20±0.01mm. Anga o Mua:Stainless Steel,T=0.20±0.01mm. Anga Whakamuri:Stainless Steel,T=0.20±0.01mm. Pikitia: Korekau, T=0.40±0.01mm. Mutunga: Hoapā: Ka whiti te koura, i runga i te rohe Whakapā. 100u-120u" Tin. Whakakikoruatia, i runga i nga hiku konutai. 50u-80u" Nickel, Underplating ki runga katoa. Hiko: Whakatauranga o naianei:1A Max. Dielectric Tuturu Ngaohiko...

WHAKATOKANGA MONO MICRO USB MOMO B Solder T3.0,L8.8mm KLS1-235-2

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā: Copper Alloy C2680. Anga: Korowai Waa C2680/SPCC. Mutu: Whakapā:Plated Gold In Mating Area; Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.5A / Whakawhiti Whakawhiti. Whakatauranga Ngaohiko:30V DC Whakapā Atete:30mΩ Max. Te Ngaohiko Korehiko: 500 V AC AT Taumata Moana. Ātete Wehenga: 1000MΩ Min. Hononga...

WHAKATOKANGA MONO MICRO USB MOMO B Solder T3.0,L6.8mm KLS1-235-1

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā: Copper Alloy C2680. Anga: Korowai Waa C2680/SPCC. Mutu: Whakapā:Plated Gold In Mating Area; Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.5A / Whakawhiti Whakawhiti. Whakatauranga Ngaohiko:30V DC Whakapā Atete:30mΩ Max. Te Ngaohiko Korehiko: 500 V AC AT Taumata Moana. Ātete Wehenga: 1000MΩ Min. Tūhono...

T5.0 KLS1-235-0 CONN PLUG MICRO USB TYPE B

Rauemi Korero mo te Hua: Whare:LCP+30%GF Whakatauranga Moowhiti:UL 94V-0 Pango. Anga:Stainless Steel. Hoapā: Hoapā parahi Whakakikoruatia Paerewa Koura: Kohiko. Hiko: Whakatauranga o naianei:0.5 Amp. Ngaohiko: 100 V AC/DC Max. Te Whakaaetanga Dielectric: 500 V AC mo te meneti kotahi. Te Mahi Mahi: -55 ° C ~ + 85 ° C Wahi Nama Whakaahua PCS / CTN GW (KG) CMB (m3) OrderQty. Te Whakataunga Wa

CONN MICRO USB 5P Solder momo KLS1-4254

Rauemi Korero mo te Hua: Whare: Te Temperature Kirihou, UL94V-0, Pango. Whakapā A: parahi T=0.20mm, Au Whakakikoruatia. Anga:Stainless Steel T=0.25mm,Ni Whakakikoruatia. Hiko: 1.Current Whakatauranga o naianei: 1.0A(Waitohu PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Whakapā Ātete:40mΩ Max. 3.Atete Whakaaetanga:100MΩ Min. 4.Dielectric Withstanding:100V AC Min. 5.Durability:10000 huringa. 6.Tuhonohono kaha Mating:35N Max (3.57Kgf). 7.Co...

CONN MICRO USB 5P Momo Topenga 1.0mm KLS1-4253

Rauemi Whakamohio Hua: Rauemi Weahanga Hangarau. Anga: Korohe Korowai/SPCC,T=0.30mm. Whakakikorua: Nika. Kāpeka: Korowai Waa,T=0.25mm. Whakakikoruatia:Gold/Tin Plated. Te Hiko: Te Whakaaetanga Whakanui: 1000MΩ Min. Atete Whakapā:30mΩ Max. Ngaohiko Tuturu: 500 V AC. Nga Ahuatanga Miihini: Te Mana Whakauru: 3.5kgf Max. Te Kaha Tangohanga:1.02kgf Min. Wāhanga Nama Whakaahua PCS/CTN GW(KG) CMB(m3) OrderQty. Te Whakataunga Wa

CONN MICRO USB 5P Momo Topenga 0.8mm KLS1-4252

Nga korero mo nga hua FAKATOKANGA: 1.Current Whakatauranga o naianei:1.0A(Signal PIN 2 3 4); 1.8A (Power PIN 1 5) 2.Whakapā Ātete:40mΩ Max. 3.Atete Whakaaetanga:100MΩ Min. 4.Dielectric Withstanding:100 V AC Min. 5.Durability:10000 huringa. 6.Tuhonohono kaha Mating:35N Max (3.57Kgf). 7.Tuhonohono kaha Unmating:8N Min (0.30Kgf). 8.Hua Tutaki Te Tono o te RoHS Wahi Nama Whakaahua PCS / CTN GW(KG) CMB(m3) OrderQty. Ti...

CONN MICRO USB 2P DIP KLS1-4251

Nga Paarama mo nga Hua Whare:Hing Temperature Thermoplastics,Black. Whakapā: Copper Alloy C1591. Anga: Korowai Waa C2680/SPCC. Mutu: Whakapaa: Whakakikoruatia te Koura i roto i te Rohe Whakahoahoa;Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.5A / Whakawhiti Whakawhiti. Whakatauranga Ngaohiko:30V DC Whakapā Atete:30mΩ Max. Te Ngaohiko Whakaaetanga Dielectric: 500 V AC AT Taumata Moana. Ātete Wehenga: 1000MΩ Min. Hoa Tuhono me te Hoa Hoa Kore i Hoahoa Mo...

CONN MICRO USB 2P R/A DIP KLS1-4250

Nga Paarama mo nga Hua Whare:Hing Temperature Thermoplastics,Black. Whakapā: Copper Alloy C1591. Anga: Korowai Waa C2680/SPCC. Mutu: Whakapaa: Whakakikoruatia te Koura i roto i te Rohe Whakahoahoa;Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.5A / Whakawhiti Whakawhiti. Whakatauranga Ngaohiko:30V DC Whakapā Atete:30mΩ Max. Te Ngaohiko Whakaaetanga Dielectric: 500 V AC AT Taumata Moana. Ātete Wehenga: 1000MΩ Min. Hoa Tuhono me te Hoa Hoa Kore i Hoahoa Mo...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4248

Nga Moohiohio Hua Nga Whare Whare:Hing Temperature Thermoplastic with GF,UL94V-0,Black. Whakapaa: Korowha Korowai, t=0.15mm. Anga: Korowai Parahi,t=0.30mm. Hiko: Whakatauranga o naianei:1A Max. Te Ngaohiko Korehiko: 100 V AC mo te 1 min. Atete Whakapā:50mΩ Max. Ātete Wehenga: 100MΩ Min. Tapeke Mating Force:3.57 kgf Max. Katoa Te Mana Whakakore: 1.0 kgf Min. Paemahana: -30°C Tae atu ki te +80°C Wahi No. Descr...

CONN RCPT 5POS MICRO USB DIP 7.2mm KLS1-4247

Nga Moohiohio Hua Nga Whare Whare:Hing Temperature Thermoplastic with GF,UL94V-0,Black Contact:Copper Alloy,t=0.20mm. Anga: Korowai Waa,t=0.25mm. Hiko: Whakatauranga o naianei:1A Max. Te Ngaohiko Korehiko: 100 V AC mo te 1 min. Atete Whakapā:50mΩ Max. Ātete Wehenga: 100MΩ Min. Tapeke Mating Force:3.57 kgf Max. Katoa Te Mana Whakakore: 1.0 kgf Min. Paemahana: -30°C Tae atu ki te +80°C Wahi No. Des...

CONN RCPT 5POS MICRO USB DIP 5.9mm KLS1-4245

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā: Copper Alloy C2680. Anga: Konukura Korowai C2680. Mutu: Whakapā:Plated Gold In Mating Area; Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.0A / Waea Whakapaa. Whakatauranga Ngaohiko:30V DC Whakapā Atete:50mΩ Max. Te Ngaohiko Korehiko: 300 V AC AT Taumata Moana. Ātete Wehenga: 100MΩ Min. Tūhono...

CONN RCPT 5POS MICRO USB SMD KLS1-4244

Nga Taonga Momo Moohio Hua:Hing Temperature Thermoplastics, UL94V-0 LCP, Pango. Whakapā: Copper Alloy C5191. Anga: Konukura Korowai C2680. Mutu: Whakapā:Plated Gold In Mating Area; Tin On Solder Talls. Anga:Nickel Plating. Hiko: Whakatauranga o naianei: 1.0A / Waea Whakapaa. Whakatauranga Ngaohiko:30V DC Whakapā Atete:50mΩ Max. Te Ngaohiko Korehiko: 300 V AC AT Taumata Moana. Ātete Wehenga: 100MΩ Min. Tūhono...
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